?
Capability
Process & CPK value
Process & CPK Value
Process Control Characteristic CPK Value
Drilling Hole Position Deviation/Hole Roughness ≥1.67 or According to customer’s request
Pattern Plating Copper thickness in hole
Outer Etching Line Width &Spacing / Impedance
Solder Mask Line Width &Spacing / Impedance
Profiling Outline Deviation(Routing)
OSP Coating Thickness
IMAG ( Immersion Silver ) Ag Thickness
IMSN ( Immersion Tin ) Tin Thickness
ENIG( Immersion Gold ) Au Thickness
丝瓜下载app - 丝瓜下载app官方 - 丝瓜下载app黄-丝瓜下载app在线